Hummer Box Coater (BC Series)

Thin Film Deposition: "D" Style Box Chamber Systems. Standard "sputter-down" configuration. Optional Sputter up or side configuration.

  

Chambers:

1. Systems are available in: 16, 20, 24 and 30-inch, "D"-style chamber sizes.

2. Stainless steel chamber construction with aluminium door and 4-inch shuttered view port. Ports for vacuum pumping and instrumentation.

3. Sputter sources are 2, 3 and 4-inch diameter (based on system size or application), flex mounted for variable angel of incidence.

4. Optional: Multiple sources in linear configurations available.




Controls:

5. Siemens S7-200 series PLC based control for vacuum function and sputtering. Fully integrated "Touch-Panel" interface control pad for setting system parameters and diagnostics. Password protection.




Safety:

6. Safety interlocks for door, power, water and vacuum.




Power Supply:

7. RF generator 300-watts, 13.56 MHz standard.

8. DC power 1500-watts.

9. Optional: RF 600 or 1000 watts. DC power 2500-watts.




Mass Flow Controller:

10. Mass flow controls, 100 - SCCM. Up to three (3) gasses maximum.




Cooling Water:

11. GPM - .2 to 10 Gallons




Pumping:

12. Remote located mechanical roughing pump can be placed outside the clean room environment. Turbomolecular pump internal to the system cabinet.

13. Optional: Cryogenic pump or larger pumps based on process requirements.




Electrical Requirements:

14. 208-240-VAC, 50/60 Hz., 40-75-Amps