Hummer 8.3 Sputter System

Hummer® 8.3 DC/ RF Sputter Systems For Insulator and/or Metal Thin Film Coatings.

1. Single cabinet design with most assemblies in the cabinetry except water chiller and roughing pump.

2. Dual stage, direct drive, rotary vane 3.8 CFM vacuum pump.

3. 81 I/ps turbomolecular pump.

4. Vacuum gauge to 1X10-5 Torr.

5. Manually controlled operation in sputter mode.

6. DC Power Supply; 1500 Watt DC.

7. RF Power Supply; 300 Watt RF, 13.56 MHz with matching network.

8. Siemens S7-200 series PLC based control. "Touch-Panel" control for setting system parameters and diagnostics.

9. Password protected process and recipes.

10. Digital display of vacuum.

11. Digital display of power.

12. Optional: End point by quartz thickness monitor, 1 to 999 nm.

13. 2" diameter RF/DC planar magnetron sputter source, requires 1 gpm at 30° C.

14. Sputter down configuration.

15. Safety interlock Hardware for vacuum and high voltage.

16. Stage diameter accommodates up to 200 mm diameter substrates.

17. Stage rotation, 2-RPM on-off selector switch.

18. Plus/minus 20% non-uniformity over 200 mm diameter substrates with rotation.

19. Chamber 300 mm diameter x 400 mm height stainless steel construction.

20. System is 535 mm x 648 mm footprint x 1219 mm height.

21. Optional: Heated stage to 400° C or 950° C.

22. Cooled stage is optional.

23. Optional: RF biased stage.

24. Optional: Mass Flow Control

25. Water chiller/recirculator is required and quoted separately.