Hummer 8.1 Sputter System

Hummer® 8.1 DC Sputter Systems For Metal Thin Film Coatings.

1. Single cabinet design with most assemblies in the cabinetry except water chiller and mechanical pump.

2. Dual stage, direct drive, rotary vane 3.8 CFM vacuum pump.

3. 81 I/ps turbomolecular pump.

4. Vacuum gauge to 1X10-5 Torr.

5. Siemens S7-200 series, PLC based control. "Touch-Panel" control pad for setting system parameters and diagnostics.

6. Password protection for process and recipes.

7. Digital display of vacuum.

8. Digital display of power.

9. DC Power supply - 1500 Watt.

10. Optional: End point by quartz thickness monitor, 1 to 999 nm.

11. 2" diameter planar magnetron sputter source, requires 1 gpm at 30° C.

12. Sputter down configuration.

13. Safety Interlock Hardware for vacuum and high voltage.

14. Stage diameter accommodates up to 200 mm diameter substrates.

15. Stage rotation 2-RPM, on-off selector switch.

16. Plus/minus 20% non-uniformity over 200 mm diameter substrates with rotation.

17. Chamber 300 mm diameter x 400 mm height stainless steel cylindrical chamber.

18. System footprint 535 mm x 648 mm x 1219 mm (w,d,h).

19. Optional: Heated stage to 400° C or 950° C.

20. Optional: Cooled stage.

21. Optional: RF biased stage.

22. Optional: Water chiller/recirculator is required, quoted separately.

23. Optional: Mass flow control.

24. Optional: Quartz thickness monitor.