Complete package ready for coating includes; plating cathode, etch cathode, pump and oil, system manual.
Single cabinet design with all assemblies in the cabinetry.
Integral dual stage, direct drive, rotary vane 3.8 cfm vacuum pump.
Manually controlled operation in plate mode.
Pulse mode of operation for 50% duty cycle.
Independently controllable, 3000 volt, 30 milliamperes power supplies, three (3).
End point by time, 1 to 14 minutes.
End point by quartz thickness monitor option, 1 to 999 nm.
Anode and dark space shield attract heat bearing electrons away from the sample.
Magnet deflects electrons into anode and dark space shield.
Targets (3) 75 mm x 50 mm annulus, each.
Safety Interlock Hardware for vacuum and high voltage.
Automatic vent at process termination.
Stage diameter accommodates up to 200 mm diameter substrates.
Grain size less than 2 nanometers.
Plus/minus 20% non-uniformity over 200 mm diameter substrates with rotation of the sample. Better uniformity for smaller substrates by varying voltage applied to sputter sources.
Chamber 300 mm diameter x 200 mm height.
Chamber is annealed, ends are ground, polished and re-annealed.
System is 559 mm x 508 mm x 356 mm. (w,d,h)
Digital display of vacuum.
Analog display of current.
Heat rise at the sample can be limited to 2° C.
Turbomolecular pumping and gauging option.
Chrome and other non-noble metals sputtering optional.
RF sputtering of insulators optional.