Complete package ready for coating includes; plating cathode, etch cathode, pump and oil, system manual.
Single cabinet design with all assemblies in the cabinetry.
Integral dual stage direct drive rotary vane 1 cfm vacuum pump.
Manually controlled operation in plate mode.
Manually controlled operation in etch mode.
Manually controlled operation in plasma mode.
Pulse mode of operation for 30% duty cycle.
3000 volt, 30 milliamperes power supply.
End point by time, 1 to 14 minutes.
End point by quartz thickness monitor option, 1 to 999 nm.
Anode and dark space shield attract heat bearing electrons away from the sample.
Magnet deflects electrons into anode and dark space shield.
Target 75 mm x 50 mm annulus.
Safety Interlock Hardware for vacuum and high voltage.
Automatic vent at process termination.
Adjustable stage height of up to 35 mm total movement.
Stage diameter accommodates up to 12 SEM pin stubs.
Stage diameter accommodates up to 100 mm diameter substrates.
Grain size less than 2 nanometers.
Carbon evaporation accessory option.
Plus/minus 10% uniformity over 75 mm diameter substrates without rotation of the sample.
Chamber 150 mm diameter x 125 mm height.
Chamber is annealed, ends are ground, polished and re-annealed.
System is 559 mm x 508 mm x 356 mm. (w,d,h)
Digital display of vacuum.
Analog display of current.
Heat rise at the sample can be limited to 2° C.
Turbomolecular pumping and gauging optional.
Chrome and other non-noble metals sputtering optional.